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IntelR Curie? Module High Density System-in-Package for IoT
2016/08/01
Ultra-small, low-power hardware module for wearables more Huawei P9 Rear-Facing Dual Camera Module
2016/07/01
With strategic technical choices in its dual camera module, Huawei is seeking to differentiate itself from Samsung and Apple more Crystal IS - OPTAN280K-BL and OPTAN-265N-SMD UVC LEDs for Spectroscopic Application and Chemical Analysis
2016/07/01
Deep ultraviolet LEDs with 265nm and 280nm peak emission on AlN single-crystal wafer more Emerging Non-Volatile Memory 2016
2016/07/01
The new storage-class memory (SCM) category will be the biggest emerging NVM market, with embedded MCU seeking emerging NVM for strategic differentiat.. more UV LEDs - Technology, Manufacturing and Application Trends
2016/07/01
After fast adoption of UVA LEDs for curing applications, UVC LEDs for purification/disinfection are now ready more ROHM 1200V Trench SiC MOSFET BSM180D12P3C007 Module
2016/07/01
The new 1200V MOSFET module from Rohm – with the first trench SiC MOSFET on the market – reduces power losses and has a higher performance/cost ratio .. more Samsung’s Galaxy S7 Processor Packages: Qualcomm/Shinko’s MCeP vs. Samsung’s PoP
2016/06/01
A comparison of both Samsung Galaxy S7 processor packages: Qualcomm Snapdragon 820 MSM8996 with MCeP packaging technology vs. Samsung Exynos 8 with TM.. more Power SiC 2016: Materials, Devices, Modules, and Applications
2016/06/01
More confident and more prepared, power SiC is progressing at a 2015 - 2021 CAGR of 19%! more Status of the Power Electronics Industry 2016
2016/06/01
With strong price pressure and a very strong leader, how will the power electronics market and landscape evolve in the future? more Status of the CMOS Image Sensor Industry 2016: New Market and Technology Dynamics
2016/06/01
New functions are pushing change in CMOS image sensors, boosting the market toward $18.8B in 2021 at 10.4% CAGR more